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XE1283
The crystal oscillator has been designed for a crystal with the specifications given below. The oscillator precision can only
be guaranteed for this crystal.
Symbol
Fs
CL
Rm
Cm
C0
Description
Resonance frequency
CL for nominal frequency
Motional resistance
Motional capacitance
Shunt capacitance
Min
-
-
-
1.8
0.7
Typ
32768
8.2
40
2.5
1.1
Max
-
15
100
3.2
2.0
Unit
Hz
pF
k ?
fF
pF
Rmp
Motional resistance
overtone (parasitic)
of
6
th
4
8
-
k ?
Q
Quality factor
30k
50k
400k
-
For safe operation, low power consumption and to meet the specified precision, careful board layout is required:
Keep lines XIN and XOUT short and insert a VSS line in between them.
Connect the crystal package to VSS.
No noisy or digital lines near XIN or XOUT.
Insert guards where needed.
Respect the board specifications below.
Symbol
Rh_xin
Rh_xout
Description
Resistance XIN-VSS
Resistance XOUT-VSS
Min
10
10
Typ
Max
Unit
M ?
M ?
Rh_xin_xout Resistance XIN-XOUT
50
M ?
Cp_xin
Cp_xout
Capacitance XIN-VSS
Capacitance XOUT-VSS
0.5
0.5
3.0
3.0
pF
pF
Cp_xin_xout Capacitance XIN-XOUT
0.2
1.0
pF
The oscillator characteristics are given below. The characteristics are valid only if the crystal and board layout meet the
specifications above.
Symbol
f Xtal
Description
Nominal frequency
Min
Typ
32768
Max
Unit
Hz
St_xtal
Fstab
Start-up time
Frequency deviation
-100
1
2
300
s
ppm
Note: Fstab gives the relative frequency deviation from nominal value for a crystal with CL=8.2 pF and within the
temperature range -40 ° C to 85 ° C. The crystal tolerance, crystal aging and crystal temperature drift are not included in this
figure.
? Semtech 2005
22
www.semtech.com
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